General Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ2554P minimizes both PCB space and RDS(ON). This monolithic common drain BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).

Features
• –6.5 A, –20 V. RDS(ON) = 28 mΩ @ VGS = –4.5 V RDS(ON) = 45 mΩ @ VGS = –2.5 V
• Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8
• Ultra-thin package: less than 0.80 mm height when mounted to PCB
• Outstanding thermal transfer characteristics: significantly better than SO-8
• Ultra-low Qg x RDS(ON) figure-of-merit
• High power and current handling capability

Applications
• Battery management
• Load switch
• Battery protection