メーカー | 部品番号 | データシート | 部品情報 |
Sangdest Microelectroni... |
303DMQ600
|
174Kb / 3P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
40CPQ015
|
129Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
MBRB10200CT
|
262Kb / 7P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
400CMQ
|
210Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
MBR2535
|
204Kb / 6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
63CPQ080
|
141Kb / 5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
301CNQ
|
206Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
MBR2035
|
170Kb / 6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
87CNQ020
|
227Kb / 5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
183NQ-1
|
184Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|