| メーカー | 部品番号 | データシート | 部品情報 |
Asahi Kasei Microsystem... |
EW-400
|
127Kb/3P
|
EW-400 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-403
|
127Kb/3P
|
EW-403 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-410B
|
128Kb/3P
|
EW-410B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-412B
|
134Kb/3P
|
EW-412B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-413
|
127Kb/3P
|
EW-413 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-432
|
134Kb/3P
|
EW-432 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-450B
|
133Kb/3P
|
EW-450B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-453
|
127Kb/3P
|
EW-453 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-463
|
132Kb/3P
|
EW-463 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-500
|
126Kb/3P
|
EW-500 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
3M Electronics |
EW-5000
|
389Kb/6P
|
3M??Scotch-Weld??Structural Adhesive Primer
|
|
EW-5005
|
347Kb/6P
|
3M??Scotch-Weld??Structural Adhesive Primer EW-5005
|
Asahi Kasei Microsystem... |
EW-610B
|
128Kb/3P
|
EW-610B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-612B
|
140Kb/3P
|
EW-612B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-632
|
135Kb/3P
|
EW-632 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-650B
|
128Kb/3P
|
EW-650B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-652B
|
134Kb/3P
|
EW-652B is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-6672
|
113Kb/2P
|
EW-6672
|
|
EW-6672
|
131Kb/3P
|
EW-6672 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
|
EW-6672
|
131Kb/3P
|
EW-6672 is composed of a Ultra-high sensitive InSb Hall element and a signal processing IC chip in a package
|
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