メーカー | 部品番号 | データシート | 部品情報 |
Toshiba Semiconductor |
GT25Q102
|
152Kb/6P
|
N CHANNEL IBGT (HIGH POWER SWITCHING APPLICATIONS)
|
GT25Q102
|
186Kb/6P
|
Silicon N Channel IGBT High Power Switching Applications
|
GT25Q102
|
1Mb/73P
|
Bipolar Small-Signal Transistors
|
GT25Q102
|
186Kb/6P
|
Silicon N Channel IGBT High Power Switching Applications
|
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Start with "GT25Q102" -
Total : 64 ( 1/4 Page) |
Toshiba Semiconductor |
GT25Q102
|
186Kb/6P |
Silicon N Channel IGBT High Power Switching Applications
|
GT25Q101
|
208Kb/3P |
N CHANNEL IGBT(HIGH POWER SWITCHING, MOTOR CONTROL APPLICATIONS)
|
GT25Q101
|
835Kb/16P |
Discrete IGBTs
|
GT25Q301
|
169Kb/7P |
N CHANNEL IGBT(HIGH POWER SWITCHING, MOTOR CONTROL APPLICATIONS)
|
GT25Q301
|
175Kb/7P |
Silicon N Channel IGBT High Power Switching Applications
|
GT25Q301
|
1Mb/73P |
Bipolar Small-Signal Transistors
|
GT25Q301
|
175Kb/7P |
Silicon N Channel IGBT High Power Switching Applications
|
Hirose Electric |
GT25-12DP-2.2H
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-12DS-HU/R
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-16DP-2.2H
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-16DP-2.2V
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-24DP-2.2H
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-24DP-2.2V
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-24DS-HU/R
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-28DP-2.2H
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|
GT25-32DP-2.2H
|
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
|