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ISCN22 Datasheet with Chat AI
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  • Part No.ISCN22
    ManufacturerISC
    Size174 Kbytes
    Pages1 page
    Descriptionisc NPN Power Transistor Die
    Datasheet Summary with AI

    # iscN22 NPN Power Transistor Die

    ## Physical Characteristics

    ️· Die Size: 300um x 300um
    ️· Thickness: 165 ± 15um
    ️· Metal Layers:
    - Solder Joint Layer: Aluminum (AL), 2.8 ± 0.3um
    - Backside Layer: Gold (Au) ≥ 1.2um
    ️· Bonding Area:
    - Emitter: 100um x 100um
    - Base: 100um x 100um
    ️· Scribe Line Size: 50um
    ️· Wafer Size: φ125mm
    ️· Estimated Gross Die Count: 114000

    ## Absolute Maximum Ratings (Ta=25℃)

    ️· VCBO: Collector-Base Voltage: 60V
    ️· VCEO: Collector-Emitter Voltage: 40V
    ️· VEBO: Emitter-Base Voltage: 6V
    ️· IC: Collector Current (Continuous): 200mA
    ️· PC: Collector Power Dissipation: 200mW
    ️· TJ: Junction Temperature: 150℃

    ## Electrical Characteristics (TC=25℃)

    ️· V(BR)CEO: Collector-Emitter Breakdown Voltage: 60V (IC=10µA, IB=0)
    ️· V(BR)CBO: Collector-Base Breakdown Voltage: 40V (IC=1mA, IE=0)
    ️· V(BR)EBO: Emitter-Base Breakdown Voltage: 6V (IE=10µA, IC=0)
    ️· VCE(sat): Collector-Emitter Saturation Voltage: 0.3V (IC=50mA, IB=5mA)
    ️· VBE(sat): Base-Emitter Saturation Voltage: 0.95V (IC=50mA, IB=5mA)
    ️· ICBO: Collector Cutoff Current: 100nA (VCB=30V, IE=0)
    ️· IEBO: Emitter Cutoff Current: 100nA (VEB=3V, IC=0)
    ️· hFE (DC Current Gain):
    - IC=10mA, VCE=1V: 100 - 300
    - IC=0.1mA, VCE=1V: 40
    - IC=100mA, VCE=1V: 30
    ️· fT (Gain Bandwidth Product): 250 MHz (VCE=20V, IC=10mA, f=100MHz)

    ## Company Information

    ️· Website: [www.iscsemi.com](http://www.iscsemi.com)
    ️· isc & iscsemi is a registered trademark.

    # iscN22 NPN Power Transistor Die

    ## Physical Characteristics

    ️· Die Size: 300um x 300um
    ️· Thickness: 165 ± 15um
    ️· Metal Layers:
    - Solder Joint Layer: Aluminum (AL), 2.8 ± 0.3um
    - Backside Layer: Gold (Au) ≥ 1.2um
    ️· Bonding Area:
    - Emitter: 100um x 100um
    - Base: 100um x 100um
    ️· Scribe Line Size: 50um
    ️· Wafer Size: φ125mm
    ️· Estimated Gross Die Count: 114000

    ## Absolute Maximum Ratings (Ta=25℃)

    ️· VCBO: Collector-Base Voltage: 60V
    ️· VCEO: Collector-Emitter Voltage: 40V
    ️· VEBO: Emitter-Base Voltage: 6V
    ️· IC: Collector Current (Continuous): 200mA
    ️· PC: Collector Power Dissipation: 200mW
    ️· TJ: Junction Temperature: 150℃

    ## Electrical Characteristics (TC=25℃)

    ️· V(BR)CEO: Collector-Emitter Breakdown Voltage: 60V (IC=10µA, IB=0)
    ️· V(BR)CBO: Collector-Base Breakdown Voltage: 40V (IC=1mA, IE=0)
    ️· V(BR)EBO: Emitter-Base Breakdown Voltage: 6V (IE=10µA, IC=0)
    ️· VCE(sat): Collector-Emitter Saturation Voltage: 0.3V (IC=50mA, IB=5mA)
    ️· VBE(sat): Base-Emitter Saturation Voltage: 0.95V (IC=50mA, IB=5mA)
    ️· ICBO: Collector Cutoff Current: 100nA (VCB=30V, IE=0)
    ️· IEBO: Emitter Cutoff Current: 100nA (VEB=3V, IC=0)
    ️· hFE (DC Current Gain):
    - IC=10mA, VCE=1V: 100 - 300
    - IC=0.1mA, VCE=1V: 40
    - IC=100mA, VCE=1V: 30
    ️· fT (Gain Bandwidth Product): 250 MHz (VCE=20V, IC=10mA, f=100MHz)

    ## Company Information

    ️· Website: [www.iscsemi.com](http://www.iscsemi.com)
    ️· isc & iscsemi is a registered trademark.

    Part No.ISCN22
    ManufacturerISC
    Size174 Kbytes
    Pages1 page
    Descriptionisc NPN Power Transistor Die
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