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KSMB540 Datasheet with Chat AI
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  • Part No.KSMB540
    ManufacturerKERSEMI
    Size660 Kbytes
    Pages4 pages
    DescriptionGreen device available.
    Datasheet Summary with AI

    # KSMB540 N-channel MOSFET

    ## Description
    An N-channel MOSFET utilizing advanced trench technology, designed for low gate charge and wide application versatility.

    ## Features
    ️· Low gate charge
    ️· Green device available
    ️· Advanced high-density trench technology for low RDS(ON)
    ️· Excellent package for heat dissipation

    ## Absolute Maximum Ratings
    ️· VDS (Drain-Source Voltage): 100V
    ️· VGS (Gate-Source Voltage): ±20V
    ️· ID (Continuous Drain Current): 28A (at 25°C), 20A (at 100°C)
    ️· Pulsed Drain Current: 110A
    ️· EAS (Single Pulse Avalanche Energy): 230 mJ
    ️· PD (Power Dissipation): 150 W
    ️· TJ, TSTG (Operating/Storage Junction Temperature): -55°C to +175°C

    ## Thermal Characteristics
    ️· RƟJC (Junction-to-Case Thermal Resistance): 62 ℃/W
    ️· RƟJA (Junction-to-Ambient Thermal Resistance): 1.0

    ## Electrical Characteristics
    ️· BVDSS (Drain-Source Breakdown Voltage): 100V
    ️· RDS(ON) (Drain-Source On Resistance): 0.077Ω (at VDS=10V, ID=6A)
    ️· VGS(th) (Gate-Source Threshold Voltage): 2.0 - 4.0 V
    ️· Qg (Total Gate Charge): 72 nC
    ️· VSD (Source-Drain Diode Forward Voltage): 2.5 V

    ## Package and Ordering Information
    ️· Part No.: KSMB540
    ️· Marking: KSMB540
    ️· Package: TO-263

    ## Key Parameters
    Parameter Conditions Min Typ Max Units
    VDS Drain-Source Voltage 100 V
    VGS Gate-Source Voltage ±20 V
    ID Continuous Drain Current-1 28 A
    ID Continuous Drain Current-T=100℃ 20 A
    EAS Single Pulse Avalanche Energy 230 mJ
    PD Power Dissipation 150 W
    TJ, TSTG Operating and Storage Junction Temperature -55 to +175

    # KSMB540 N-channel MOSFET

    ## Description
    An N-channel MOSFET utilizing advanced trench technology, designed for low gate charge and wide application versatility.

    ## Features
    ️· Low gate charge
    ️· Green device available
    ️· Advanced high-density trench technology for low RDS(ON)
    ️· Excellent package for heat dissipation

    ## Absolute Maximum Ratings
    ️· VDS (Drain-Source Voltage): 100V
    ️· VGS (Gate-Source Voltage): ±20V
    ️· ID (Continuous Drain Current): 28A (at 25°C), 20A (at 100°C)
    ️· Pulsed Drain Current: 110A
    ️· EAS (Single Pulse Avalanche Energy): 230 mJ
    ️· PD (Power Dissipation): 150 W
    ️· TJ, TSTG (Operating/Storage Junction Temperature): -55°C to +175°C

    ## Thermal Characteristics
    ️· RƟJC (Junction-to-Case Thermal Resistance): 62 ℃/W
    ️· RƟJA (Junction-to-Ambient Thermal Resistance): 1.0

    ## Electrical Characteristics
    ️· BVDSS (Drain-Source Breakdown Voltage): 100V
    ️· RDS(ON) (Drain-Source On Resistance): 0.077Ω (at VDS=10V, ID=6A)
    ️· VGS(th) (Gate-Source Threshold Voltage): 2.0 - 4.0 V
    ️· Qg (Total Gate Charge): 72 nC
    ️· VSD (Source-Drain Diode Forward Voltage): 2.5 V

    ## Package and Ordering Information
    ️· Part No.: KSMB540
    ️· Marking: KSMB540
    ️· Package: TO-263

    ## Key Parameters
    Parameter Conditions Min Typ Max Units
    VDS Drain-Source Voltage 100 V
    VGS Gate-Source Voltage ±20 V
    ID Continuous Drain Current-1 28 A
    ID Continuous Drain Current-T=100℃ 20 A
    EAS Single Pulse Avalanche Energy 230 mJ
    PD Power Dissipation 150 W
    TJ, TSTG Operating and Storage Junction Temperature -55 to +175

    Part No.KSMB540
    ManufacturerKERSEMI
    Size660 Kbytes
    Pages4 pages
    DescriptionGreen device available.
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