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STM32L433CB データシート(PDF) 204 Page - STMicroelectronics |
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STM32L433CB データシート(HTML) 204 Page - STMicroelectronics |
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204 / 225 page  Package information STM32L433xx 204/225 DS11449 Rev 5 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 54. UFBGA64 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 108. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) (continued) Dimension Recommended values MSv40921V1 Product identification (1) 32L433C6 WW Y A Date code Pin 1 identifier |
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