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STM32H747AI データシート(PDF) 247 Page - STMicroelectronics |
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STM32H747AI データシート(HTML) 247 Page - STMicroelectronics |
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247 / 252 page ![]() DS12930 Rev 1 237/242 STM32H747xI/G Package information 240 Device marking for TFBGA240+25 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 85. TFBGA240+25 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 137. TFBGA240+25 recommended PCB design rules (0.8 mm pitch) Dimension Recommended values Pitch 0.8 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm MSv61393V1 Revision code Ball A1identifier ES32H747XIH6 Y WW Product identification(1) Date code R |
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