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STM32G47PBY3XXX データシート(PDF) 208 Page - STMicroelectronics |
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STM32G47PBY3XXX データシート(HTML) 208 Page - STMicroelectronics |
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208 / 229 page ![]() Package information STM32G473xB STM32G473xC STM32G473xE 208/229 DS12712 Rev 3 6.5 LQFP80 package information LQFP80 is a 80-pin, 12 x 12 mm low-profile quad flat package. Figure 65. LQFP80 - outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 111. LQFP80 - mechanical data Symbol Millimeters inches(1) Min Typ Max Min Typ Max A - - 1.600 - - 0.0630 A1 0.050 - 0.150 0.0020 - 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 - 0.200 0.0035 - 0.0079 1 20 40 21 41 60 61 80 D3 D1 D IDENTIFICATION PIN 1 L L1 k C SEATING PLANE GAUGE PLANE 0.25 mm C ccc 9X_ME e |
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