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STM32WB35CCU6ATR データシート(PDF) 175 Page - STMicroelectronics |
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STM32WB35CCU6ATR データシート(HTML) 175 Page - STMicroelectronics |
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175 / 193 page  DS11929 Rev 10 175/193 STM32WB55xx STM32WB35xx Package information 185 Figure 42. WLCSP100 recommended footprint 1. Dimensions are expressed in millimeters. Device marking for WLCSP100 Figure 43 gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Table 103. WLCSP100 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm A08S_WLCSP100_FP_V1 Dpad Dsm |
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