D301 datasheet(413/416 Pages) MICROCHIP

413 / 416 page

 2016-2018 Microchip Technology Inc.

DS30010118D-page 413

PIC24FJ256GA705 FAMILY

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Architecture

= 16-Bit Modified Harvard without DSP

Flash Memory Family FJ

= Flash Program Memory

Pin Count

= 28-pin (QFN, UQFN, SOIC, SSOP, SPDIP)

= 44-pin (TQFP)

= 48-pin (UQFN, TQFP)

Temperature Range

= -40

C to +85C (Industrial)

E= -40

C to +125C (Extended)

Package

ML = 28-Lead (6x6 mm) QFN (Plastic Quad Flat)

MV = 28-Lead (4x4x0.6 mm) UQFN (Ultra Thin Quad Flatpack)

SO = 28-Lead (7.50 mm) SOIC (Plastic Small Outline)

SS = 28-Lead (5.30 mm) SSOP (Plastic Shrink Small Outline)

SP = 28-Lead (300 mil) SPDIP (Skinny Plastic Dual In-Line)

PT = 44-lead (10x10x1 mm) TQFP (Thin Quad Flatpack)

M4 = 48-Lead (6X6 mm) UQFN (Plastic Quad Flat)

PT = 48-Lead (7x7x1 mm) TQFP (Thin Quad Flatpack)

Pattern

QTP, SQTP, Code or Special Requirements

(blank otherwise)

ES = Engineering Sample

Examples:

PIC24FJ256GA705-I/PT:

PIC24F General Purpose Device, 48-Pin,

Industrial Temp., TQFP Package.

PIC24FJ256GA702-E/ML:

PIC24F General Purpose Device, 28-Pin,

Extended Temp., QFN Package

Microchip Trademark

Architecture

Flash Memory Family

Program Memory Size (Kbytes)

Product Group

Pin Count

Temperature Range

Package

Pattern

PIC 24 FJ 256 GA7 05 T - I / PT - XXX

Tape and Reel Flag (if applicable)

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