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データシートサーチシステム |
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AM68AX データシート(PDF) 249 Page - Texas Instruments |
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AM68AX データシート(HTML) 249 Page - Texas Instruments |
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249 / 251 page  NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4226636/A 03/2021 www.ti.com FCBGA - 2.57 mm max height ALZ0770A BALL GRID ARRAY SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 0.225X (0.8) TYP (0.8) TYP 770X (Ø 0.4) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH SOLDER MASK DETAILS NOT TO SCALE Ø 0.4 (METAL) SOLDER MASK OPENING 0.07 MAX EXPOSED METAL NON-SOLDER MASK DEFINED (PREFERRED) (Ø 0.4) SOLDER MASK OPENING 0.07 MAX METAL UNDER SOLDERMASK SOLDER MASK DEFINED EXPOSED METAL |
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