BM78_V01 datasheet(41/60 Pages) MICROCHIP

部品番号	BM78

部品情報	Bluetooth® Dual-Mode Module

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メーカー	MICROCHIP [Microchip Technology]

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 2016-2019 Microchip Technology Inc.

DS60001380B-Page 41

BM78

7.0

REFLOW PROFILE MODULE

The BM78 module is assembled using a standard

lead-free reflow profile, IPC/JEDEC J-STD-020. The

BM78 module can be soldered to the host PCB by

using the standard leaded and lead-free solder reflow

profiles.

To avoid damage to the module, follow these recom-

mendations:

• Refer to AN233 Solder Reflow Recommendation

application note (DS00233) for the soldering

reflow recommendations

• The peak temperature should not exceed (TP) of

+250ºC

• Use no-clean flux solder paste

• Do not wash the module as moisture can be

trapped under the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow

• Standard: IPC/JEDEC J-STD-020:

- Condition: Preheat:+150ºC to +200ºC for



60 to 120 seconds

- Average ramp-up rate (+217ºC to peak):



+3ºC/sec max

- Temperature maintained above +217ºC:



60 to 150 seconds

- Time within +5ºC of peak temperature:



30 to 40 seconds

- Peak temperature: +260ºC with +5/0ºC toler-

ance

- Ramp-down rate (peak to +217ºC):



+6ºC/sec max

- Time within +25ºC to peak temperature:



8 minutes max

- Cycle interval 5 minutes

Figure 7-1 illustrates the reflow profile of the



BM78 module.

FIGURE 7-1:

REFLOW PROFILE

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