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STM32H7B3AI データシート(PDF) 150 Page - STMicroelectronics

部品番号 STM32H7B3AI
部品情報  32-bit Arm® Cortex®-M7 280 MHz MCUs, 2-Mbyte flash memory, 1.4-Mbyte RAM, 46 com. and analog interfaces, SMPS, crypto
PDF  238 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H7B3AI データシート(HTML) 150 Page - STMicroelectronics

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2.
Ideal transfer curve.
3.
End point correlation line.
4.
ET = Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves.
5.
EO = Offset Error: deviation between the first actual transition and the first ideal one.
6.
EG = Gain Error: deviation between the last ideal transition and the last actual one.
7.
ED = Differential Linearity Error: maximum deviation between actual steps and the ideal one.
8.
EL = Integral Linearity Error: maximum deviation between any actual transition and the end point correlation
line.
Figure 56. Typical connection diagram using the ADC with FT/TT pins featuring analog switch function
MSv67871V3
Sample-and-hold ADC converter
Converter
Cparasitic(2)
Ilkg(3)
CADC
VDDA(4)
RAIN(1)
VAIN
RADC
VREF+(4)
VSSA
I/O
analog
switch
Sampling
switch with
multiplexing
VSS
VSS
1.
Refer to Table 93. ADC characteristics for the values of RAIN and CADC.
2.
Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (refer to Table 65. I/O static characteristics). A high Cparasitic value downgrades conversion
accuracy. To remedy this, fADC should be reduced.
3.
Refer to Table 65. I/O static characteristics for the value of Ilkg.
4.
Refer to .Figure 21. Power supply scheme.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 57. Power supply and reference decoupling
(VREF+ not connected to VDDA) or Figure 58. Power supply and reference decoupling (VREF+ connected to VDDA),
depending on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good
quality). They should be placed them as close as possible to the chip.
STM32H7B3xI
Operating conditions
DS13139 - Rev 8
page 150/238



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