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STM32H7B3AI データシート(PDF) 196 Page - STMicroelectronics |
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STM32H7B3AI データシート(HTML) 196 Page - STMicroelectronics |
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196 / 238 page  7.3.1 Device marking for TFBGA100 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 90. TFBGA100 marking example (package top view) STM32H7B3 VIH6 Y WW Revision code Product identification(1) Date code Ball 1 indentifier 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. STM32H7B3xI TFBGA100 package information DS13139 - Rev 8 page 196/238 |
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