6. Soldering Profile

(1) Reflow Soldering Conditions / Profile

Preliminary heat to be at maximum 210ºC for maximum 2 minutes.

Soldering heat to be at maximum 240ºC for maximum 10 seconds.

(2) Lead-free solder

Preliminary heating to be at maximum 220

°C for maximum 2 minutes.

Soldering heat to be at maximum 260

°C for maximum 10 seconds.

(3) Hand Soldering conditions

Not more than 5 seconds @MAX 300

°C, under Soldering iron.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

SEOUL SEMICONDUCTOR CO., LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea

Phone : 82-2-2106-7305~6

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SSC-MWT801

SSC-QP-0401-06(REV24)

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