データシートサーチシステム |
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ISD1700 データシート(PDF) 18 Page - Winbond |
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ISD1700 データシート(HTML) 18 Page - Winbond |
18 / 24 page ISD1700 SERIES - 18 - Example #3: Connecting the SPI Interface to a microcontroller ISD1700 R OSC ERASE PLAY REC AGC AnaIn MIC - MIC+ MISO MOSI SCLK SS FWD VOL 24 23 25 26 19 10 11 20 18 22 9 7 6 5 4 *** At 8kHz sampling freq, Rosc = 80 K Rosc *** 4.7 F μ FT 0.1 F μ To uC SPI : Digital ground; : Analog ground; : Ground for SP+; : Ground for SP- Vcc Gnd V CCA SP+ AUD/AUX V SSD V CCD V CCA 0.1 F μ LED 1 K Ω V CCD * D1 2 1 28 17 V CCA V CCD V CCP V SSA V CCP V SSP1 SP- V SSP2 V CCP 0.1 F μ 0.1 F μ * * 21 8 14 16 12 0.1 F μ * INT/RDY 27 ** ** 15 13 Speaker or Buzzer V CCD Optional Ω 100 K vAlert Optional: based upon the applications 390 Ω 0.1 F μ V CC 8050C Speaker AUX AUD 3 RESET 0.1 F μ Reset 10.1 GOOD AUDIO DESIGN PRACTICES To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family.pdf Good Audio Design Practices http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf |
同様の部品番号 - ISD1700 |
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同様の説明 - ISD1700 |
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