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STM32F446RC データシート(PDF) 190 Page - STMicroelectronics |
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STM32F446RC データシート(HTML) 190 Page - STMicroelectronics |
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190 / 202 page  Package information STM32F446xC/E 190/202 DocID027107 Rev 6 Figure 80. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package recommended footprint F 0.550 0.600 0.650 0.0177 0.0197 0.0217 ddd - - 0.080 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 114. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 113. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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