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LFSC データシート(PDF) 222 Page - Lattice Semiconductor |
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LFSC データシート(HTML) 222 Page - Lattice Semiconductor |
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222 / 237 page  4-148 Pinout Information Lattice Semiconductor LatticeSC/M Family Data Sheet Thermal Management Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets. Designers must complete a thermal analysis of their specific design to ensure that the device and package do not exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package specific thermal values. For Further Information For further information regarding Thermal Management, refer to the following located on the Lattice website at www.latticesemi.com. • Thermal Management document • Technical Note TN1101 - Power Estimation and Management for LatticeSC Devices • Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from www.latticesemi.com/software |
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