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MCIMX503CVM8B データシート(PDF) 115 Page - Freescale Semiconductor, Inc |
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MCIMX503CVM8B データシート(HTML) 115 Page - Freescale Semiconductor, Inc |
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115 / 134 page  Package Information and Contact Assignments i.MX50 Applications Processors for Consumer Products, Rev. 2 Freescale Semiconductor 115 5.3 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package Information This section contains the outline drawing, signal assignment map, ground, power, reference ID (by ball grid location) for the 17 x 17 mm, 0.8 mm pitch, 400 pin MAPBGA package. VDD2P5 AD4 — VDD3P0 AD3 — VDDA P17, R17 — VDDAL1 P15, R15 — VDDGP G10, G8, G9, H10, H7, H8, H9, J7, J8, K10, K7, K8, L10, L7, L8 — VDDO25 N23 — VSS A1, A24, AA11, AA18, AA2, AA9, AC18, AC3, AC4, AC6, AC7, AD1, AD18, AD24, E17, E18, E21, E8, E9, F21, G11, G12, G13, G21, G23, H11, H12, H13, K11, K12, K13, L11, L12, L13, L14, L17, M11, M14, M15, M17, N11, N14, N15, N17, P11, P12, P13, P14, R11, R12, R13, R14, T17, U12, U13, U14, U15, U16, U17 — Table 81. 416 PoPBGA 13 x 13 mm Ground, Power, Sense, and Reference Contact Signals (continued) |
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