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M24LR04E-R データシート(PDF) 134 Page - STMicroelectronics

部品番号 M24LR04E-R
部品情報  4-Kbit EEPROM with password protection, dual interface & energy harvesting: 400 kHz I²C bus & ISO 15693 RF protocol at 13.56 MHz
PDF  142 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24LR04E-R データシート(HTML) 134 Page - STMicroelectronics

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Package mechanical data
M24LR04E-R
134/142
Doc ID 022208 Rev 5
Figure 88.
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package outline
1.
Drawing is not to scale.
2.
The central pad (E2 × D2 area in the above illustration) is internally pulled to VSS. It must not be allowed to
be connected to any other voltage or signal line on the PCB, for example during the soldering process.
3.
The circle in the top view of the package indicates the position of pin 1.
Table 127.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
D2 (rev MC)
1.200
1.600
0.0472
0.0630
E
3.000
2.900
3.100
0.1181
0.1142
0.1220
E2 (rev MC)
1.200
1.600
0.0472
0.0630
e
0.500
0.0197
K
0.300
0.0118
L
0.300
0.500
0.0118
0.0197
L1
0.150
0.0059
L3
0.300
0.0118
eee(2)
2.
Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.080
0.0031
D
E
ZW_MEe
A
A1
eee
L1
e
b
D2
L
E2
L3
L1
e
b
D2
L
E2
L3
Pin 1
K
K
MB
MC



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