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WM8946ECS/R データシート(PDF) 173 Page - Wolfson Microelectronics plc |
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WM8946ECS/R データシート(HTML) 173 Page - Wolfson Microelectronics plc |
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173 / 175 page  Production Data WM8946 w PD, July 2012, Rev 4.3 173 PACKAGE DIMENSIONS B: 36 BALL W-CSP PACKAGE 2.970 X 3.070 X 0.7mm BODY, 0.50 mm BALL PITCH A1 CORNER TOP VIEW E D 5 4 DETAIL 2 DETAIL 2 A A2 2 A1 Z bbb Z 1 E1 A D1 DETAIL 1 D C B F E e e BOTTOM VIEW 1 65 4 32 6 G NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING. 3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C. A1 0.207 D D1 E E1 e 2.500 BSC 3.070 0.223 2.500 BSC 0.500 BSC 2.970 Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.700 A2 0.418 0.434 0.450 5 f1 0.740 0.660 0.244 0.281 g 0.022 h 0.314 f2 0.273 f1 f2 h DM063.B 2.945 2.995 3.045 3.095 0.264 0.364 A aaa 2 X B aaa 2 X B A Z ddd M A B Z ccc aaa bbb ccc ddd 0.025 0.060 0.030 0.015 |
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