データシートサーチシステム |
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LM3448 データシート(PDF) 5 Page - Texas Instruments |
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LM3448 データシート(HTML) 5 Page - Texas Instruments |
5 / 43 page LM3448 www.ti.com SNOSB51B – SEPTEMBER 2011 – REVISED NOVEMBER 2011 ELECTRICAL CHARACTERISTICS (1) (continued) VCC = 12V unless otherwise noted. Limits in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25ºC and are provided for reference purposes only. Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units IDS SW to ISNS leakage current (4) SW - ISNS = 600V 1 µA RON SW to ISNS switch on resistance 3.6 Ω THERMAL SHUTDOWN TSD Thermal shutdown temperature See (5) 165 °C Thermal shutdown hysteresis 20 THERMAL RESISTANCE R θJA Junction to Ambient See (5) (6) 95 °C/W (4) High voltage devices such as the LM3448 are susceptible to increased leakage currents when exposed to high humidity and high pressure operating environments. Users of this device are cautioned to satisfy themselves as to the suitability of this product in the intended end application and take any necessary precautions (e.g. system level HAST/HALT testing, conformal coating, potting, etc.) to ensure proper device operation. (5) These electrical parameters are guaranteed by design and are not verified by test. (6) This R θJA typical value determined using JEDEC specifications JESD51-1 to JESD51-11. However junction-to-ambient thermal resistance is highly board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3448 |
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