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HQ データシート(PDF) 5 Page - MERITEK ELECTRONICS CORPORATION

部品番号 HQ
部品情報  Surface mount device with high reliability
Download  8 Pages
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メーカー  MERITEK [MERITEK ELECTRONICS CORPORATION]
ホームページ  http://www.meritekusa.com
Logo MERITEK - MERITEK ELECTRONICS CORPORATION

HQ データシート(HTML) 5 Page - MERITEK ELECTRONICS CORPORATION

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Rev. 7a
 
Multilayer Ceramic Capacitors
HQ Series
(High Q)
 
No.
Item
Test Conditions
Requirements
4.
Dielectric
Strength
* To apply voltage: 250% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec.
≥10GΩ
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force:
5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hours each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10. Bending Test
* The middle part of substrate shall be pressurized by
means of the pressurizing rod at a rate of about 1 mm per
second until the deflection becomes 1 mm and then the
pressure shall be maintained for 5±1 sec.
* Measurement to be made after keeping at room temp for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance
under specified flexure of substrate from the capacitance
measured before the test.)
11. Resistance to
Soldering
Heat
* Solder temperature: 270±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp for
24±2 hrs. (Class I) or 48±4 hrs. (Class II).
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max leaching on each edge.
12. Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C)
Time (min.)
1
Min. operating temp. +0/-3
30±3
2
Room temp.
2~3
3
Max operating temp. +3/-0
30±3
4
Room temp.
2~3
* Measurement to be made after keeping at room temp for
24±2 hrs.
* No remarkable damage.
* Cap change:within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
13. Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
* Measurement to be made after keeping at room temp for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* I.R.: ≥1GΩ.
14. Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltage:rated voltage
* Measurement to be made after keeping at room temp for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ.
 


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