SWCS049H datasheet(105/119 Pages) TI1

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105

TPS659110, TPS659112, TPS659113

TPS659114, TPS659118, TPS6591133

www.ti.com

SWCS049Q – JUNE 2010 – REVISED MARCH 2016

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Product Folder Links: TPS659110 TPS659112 TPS659113 TPS659114 TPS659118 TPS6591133

Applications, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

7.1

Package Description

The following table lists the package descriptions for the TPS65911x PMU devices:

PACKAGE

TPS65911x

Type

ZRC98 BGA Microstar Junior

Size (mm)

6 × 9

Substrate layers

1 layer

Pitch ball array (mm)

0.65 mm

Number of balls

Thickness (mm) (maximum height including balls)

1 mm

7.2

PCB Layout

The package ballout of the TPS65911x device supports the use of inexpensive 4-layer, non-HID board

technology. Figure 7-1 shows an example layout.

Regardless of the chosen board technology, special care must be taken when designing the board layout

for the TPS65911x to ensure performance. For detailed guidelines, see TPS65911 Layout Guidelines

(SWCU080).

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