SMM0204

www.vishay.com

Vishay Draloric

Revision: 09-Dec-15

10

Document Number: 20004

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

4.17

58 (Td)

Solderability

Solder bath method;

SnPb40;

non-activated flux

(215 ± 3) °C;

(3 ± 0.3) s

Good tinning (

≥ 95% covered); no visible damage

Solder bath method;

SnAg3Cu0.5

or SnAg3.5;

non-activated flux;

(235 ± 3) °C;

(2 ± 0.2) s

Good tinning (

≥ 95% covered); no visible damage

4.18

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C;

(10 ± 1) s

± (0.1 %

R + 0.01 Ω)

± (0.05 %

R + 0.01 Ω)

Reflow method 2

(IR/forced gas

convection);

(260 ± 5) °C;

(10 ± 1) s

± (0.05 %

R + 0.01 Ω)

± (0.02 %

R + 0.01 Ω)

4.29

45 (XA)

Component

solvent

resistance

Isopropyl alcohol;

50 °C;

method 2

No visible damage

4.30

45 (XA)

Solvent

resistance

of marking

Isopropyl alcohol;

50 °C;

method 1,

toothbrush

Marking visible, no visible damage

4.32

Shear

(adhesion)

45 N

No visible damage

4.33

Substrate

bending

Depth 2 mm,

3 times

No visible damage, no open circuit in bent position

± (0.05 % + 0.005 

Ω)

4.7

-

Voltage proof

No flashover or breakdown

4.35

-

Flammability

needle flame test;

10 s

No burning after 30s

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

ΔR)

SMM0204

< 1

Ω

1

Ω to < 10 Ω

10

Ω to ≤ 1 MΩ

> 1 M

Ω