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STM8AF5269 データシート(PDF) 122 Page - STMicroelectronics |
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STM8AF5269 データシート(HTML) 122 Page - STMicroelectronics |
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122 / 125 page ![]() Revision history STM8AF526x/8x/Ax STM8AF6269/8x/Ax 122/125 DocID14395 Rev 15 18-Jul-2012 9 (continued) Table 26: Total current consumption in Run, Wait and Slow mode. General conditions for VDD apply, TA = -40 °C to 150 °C: updated conditions for IDD(RUN). Table 38: I/O static characteristics: added new condition and new max values for rise and fall time; updated footnote 2. Section 10.3.7: Reset pin characteristics: updated text below Figure 38: Typical NRST pull-up current Ipu vs VDD Figure 39: Recommended reset pin protection: updated unit of capacitor. Table 41: SPI characteristics: updated SCK high and low time conditions and values. Figure 42: SPI timing diagram - master mode: replaced ‘SCK input’ signals with ‘SCK output’ signals. Updated Table 49: LQFP80 - 80-pin, 14 x 14 mm low-profile quad flat package mechanical data, Table 50: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package mechanical data, Table 51: LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package mechanical data, Table 52: LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package mechanical data, Table 53: VFQFPN32 - 32-pin, 5 x 5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package mechanical data Replaced Figure 48: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline, Figure 51: LQFP48 - 48-pin, 7 x 7 mm low- profile quad flat package outline and Figure 54: LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline Added Figure 49: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package recommended footprint, Figure 52: LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package recommended footprint and Figure 55: LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package recommended footprint Updated Figure 57: VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package outline Updated Figure 60: STM8AF526x/8x/Ax and STM8AF6269/8x/Ax ordering information scheme1 Section 13.2.2: C and assembly toolchains: added www.iar.com. 31-Mar-2014 10 Updated: – Table 1: Device summary, – Table: STM8AF52xx product line-up with CAN, – Table: STM8AF/H/P51xx product line-up with CAN, – Table: STM8AF/H/P61xx product line-up without CAN, – Table 11: STM8AF526x/8x/Ax and STM8AF6269/8x/Ax pin description, – The maximum speed in Section 5.9.3: Serial peripheral interface (SPI), –tTEMP Reset release delay /VDD rising typical and max values in Table 25: Operating conditions at power-up/power-down, – The symbol tIFP(NRST) with tINFP(NRST) in Table 39: NRST pin characteristics, – The address and comment for Reset in Table 17: STM8A interrupt table. Table 55. Document revision history (continued) Date Revision Changes |
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