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STM8AL3136 データシート(PDF) 104 Page - STMicroelectronics |
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STM8AL3136 データシート(HTML) 104 Page - STMicroelectronics |
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104 / 124 page  Electrical parameters STM8AL313x/4x/6x STM8AL3L4x/6x 104/124 DocID18474 Rev 7 Figure 38. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 39 or Figure 40, depending on whether VREF+ is connected to VDDA or not. Good quality ceramic 10 nF capacitors should be used. They should be placed as close as possible to the chip. Table 60. RAIN max for fADC = 16 MHz(1) Ts (cycles) Ts (µs) RAIN max (kohm) Slow channels Fast channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V 4 0.25 Not allowed Not allowed 0.7 Not allowed 9 0.5625 0.8 Not allowed 2.0 1.0 16 1 2.0 0.8 4.0 3.0 24 1.5 3.0 1.8 6.0 4.5 48 3 6.8 4.0 15.0 10.0 96 6 15.0 10.0 30.0 20.0 192 12 32.0 25.0 50.0 40.0 384 24 50.0 50.0 50.0 50.0 1. Guaranteed by design, not tested in production. |
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