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STM32F302XD データシート(PDF) 152 Page - STMicroelectronics |
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STM32F302XD データシート(HTML) 152 Page - STMicroelectronics |
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152 / 168 page  Package information STM32F302xD STM32F302xE 152/168 DocID026900 Rev 4 Figure 58. Recommended footprint for the UFBGA100 package Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 94. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 93. UFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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