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STM32F732ICK6 データシート(PDF) 112 Page - STMicroelectronics |
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STM32F732ICK6 データシート(HTML) 112 Page - STMicroelectronics |
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112 / 122 page  Package information STM32F732xx STM32F733xx 112/122 DocID028480 Rev 1 Figure 34. UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 19. UFBGA144 recommended PCB design rules (0.50 mm pitch BGA) Dimension Recommended values Pitch 0.50 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 18. UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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