The **ATS-03F-190-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. While it is not an active electronic component (like a transistor or IC), it is a critical mechanical part used for thermal management in electronic assemblies. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Brass pins) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 3.62°C/W (at 200 LFM) | | **Airflow Path** | Fine Pitch (straight fins) | --- ### 2. Design and Components The part is engineered to dissipate heat from surface-mount components (like CPUs, FPGAs, or GPUs) into the surrounding air. #### A. The Heat Sink Body * **High-Performance Fins:** The "190" series features a fine-pitch fin pattern designed for high-density airflow. * **Aluminum Construction:** Offers a balance between weight, cost, and high thermal conductivity. * **Blue Anodized Finish:** Provides a protective layer against corrosion and slightly improves radiant heat transfer. #### B. The pushPIN™ Attachment System This specific model uses the ATS **pushPIN™** system, which consists of: * **Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provides a precise "firm" attachment force (measured in pounds per square inch) to ensure optimal contact with the electronic component. * **Flexible Mounting:** Designed to be installed and removed easily without damaging the board. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-03F-190-C2-R0 depends heavily on the velocity of the air moving through it (LFM - Linear Feet per Minute): * **Low Airflow (200 LFM):** ~3.62 °C/W * **High Airflow (500 LFM):** ~1.99 °C/W * **Note:** Lower °C/W values indicate better cooling performance. --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **03F:** Series designation (Material/Design). * **190:** Specific fin geometry/density. * **C2:** Thermal Interface Material (TIM) type or specific coating variant. * **R0:** Revision or packaging code.