The **ATS-08F-75-C1-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table breaks down the physical and thermal properties of this specific part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.95°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Interface Material (TIM)** | ATS-51 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the configuration: * **ATS-08**: Refers to the series/family (Push-Pin Heat Sinks). * **F**: Indicates the fin pattern/density (Cross-Cut). * **75**: Denotes the specific length/width footprint (25mm x 25mm). * **C1**: Specifies the material/thermal performance grade. * **R0**: Refers to the RoHS compliance and standard packaging version. --- ### 3. Core Component Features #### A. Cross-Cut Fin Design The fins are designed in a grid-like "cross-cut" pattern. This is superior to straight fins because it allows for **omnidirectional airflow**, meaning it can receive cooling air from any direction, making it ideal for systems with complex internal air turbulence. #### B. Push-Pin Mounting System Instead of using messy adhesives or thermal tape, this part uses a mechanical push-pin system. - **Brass Pins:** Provides durable, repeatable pressure. - **Compression Springs:** Ensures consistent contact force between the heat sink and the chip, which optimizes heat transfer. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **ATS-51**, a high-performance thermal grease. This eliminates the need for the technician to apply paste manually and ensures a bubble-free connection to the electronic component. --- ### 4. Applications This part is commonly used in: * **Telecommunications:** Cooling small processors in routers and switches. * **Industrial PC:** Cooling chipsets on motherboards. * **Power Supplies:** Managing heat for voltage regulators and MOSFETs. ---