The **ATS-55150K-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to optimize airflow and thermal dissipation for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Dimension (L x W x H)** | 15mm x 15mm x 14.5mm | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 10.9° C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | maxiGRIP™ (Clip-on) | | **Attachment Category** | Mechanical (No holes required in PCB) | --- ### 2. Key Design Elements #### A. Fin Geometry (maxiFLOW™) The "K" in the part number often refers to the specific flared fin geometry. Unlike standard straight-fin heat sinks, these fins are tapered and angled to: * Increase surface area without significantly increasing the footprint. * Reduce pressure drop, allowing air to pass through more efficiently. * Capture "wasted" air from the sides and top of the fan stream. #### B. The maxiGRIP™ Attachment System This is a critical electronic hardware feature. It consists of two main parts: 1. **Plastic Frame Clip:** A high-tension clip that sits around the component. 2. **Stainless Steel Spring Clip:** A "bridge" that snaps over the heat sink, applying consistent downward pressure (PSI). * **Benefit:** It avoids the need for permanent thermal adhesives (tape/epoxy) or drilling holes in the PCB, making it reworkable and safer for delicate BGA packages. --- ### 3. Material and Interface * **Aluminum Body:** Provides a balance between thermal conductivity and lightweight construction (important for shock/vibration stability). * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **Chomerics T766** or a similar high-performance phase-change material to fill microscopic air gaps between the component and the heat sink. --- ### 4. Common Applications Due to its small 15mm x 15mm footprint, it is typically used for: * **Networking:** Small SFP modules or micro-controllers. * **Embedded Systems:** Industrial PCs where space is limited. * **Power Management:** Regulators that require localized cooling.