The **ATS-55150W-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for high-density electronic cooling applications such as BGA (Ball Grid Array) components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | superGRIP™ (Clip-on) | | **Material** | Aluminum | | **Finish** | Black Anodized | | **Dimensions (L x W x H)** | 15mm x 15mm x 24.5mm | | **Thermal Resistance** | 5.30 °C/W @ 200 LFM | | **Fin Type** | Cross-Cut (Straight Fin) | | **Compliance** | RoHS Compliant | --- ### 2. Key Electronic & Mechanical Parts The assembly consists of three primary elements that work together to manage heat: * **The Heat Sink Body:** A cross-cut aluminum block that increases surface area. The high-aspect-ratio fins are designed to allow airflow from multiple directions, making it ideal for crowded PCBs where airflow might be unpredictable. * **The superGRIP™ Clip:** A plastic frame that surrounds the electronic component. It provides a secure, mechanical attachment without the need for drilling holes in the PCB. * **The Metal Spring Clip:** A "C-shaped" stainless steel spring that snaps over the heat sink and into the plastic frame. This ensures constant downward pressure (interface pressure), which is critical for maximizing heat transfer from the chip to the sink. --- ### 3. Application Use Cases This specific part is used for cooling small, high-heat-generating electronic components, including: 1. **Network Switches:** Cooling ASICs and high-speed processors. 2. **Embedded Systems:** Protecting microcontrollers in compact enclosures. 3. **Telecommunications:** Managing heat in RF modules and signal processors. --- ### 4. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the pre-applied thermal interface. - **Function:** It fills microscopic air gaps between the component surface and the heat sink base. - **Benefit:** It significantly lowers the contact resistance, allowing heat to flow efficiently into the aluminum fins.