The **ATS-55310K-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components that require efficient thermal management in restricted spaces. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 31mm x 31mm x 14.5mm | | **Material** | Aluminum (Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance (Flowing Air)** | ~3.30 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~10.40 °C/W | | **Compliance** | RoHS Compliant | --- ### 2. Core Electronic/Thermal Features #### A. maxiFLOW™ Fin Design Unlike traditional straight-fin heat sinks, the maxiFLOW™ design uses a **tapered fin profile**. This geometry: * Reduces pressure drop across the heat sink. * Increases the effective surface area for heat dissipation. * Optimizes airflow in high-density PCB environments. #### B. maxiGRIP™ Attachment System One of the most critical "parts" of this assembly is the mounting mechanism. It uses a **plastic frame clip** and a **stainless steel "X-shaped" spring clip**. * **No Holes Required:** It attaches directly to the component without needing holes drilled into the PCB. * **Steady Pressure:** Ensures consistent contact between the heat sink and the chip (CPU, GPU, or FPGA), maximizing thermal transfer. * **Ease of Rework:** The clip can be removed and reapplied without damaging the board. #### C. Thermal Interface Material (TIM) The "C2" or "R0" designations often indicate the factory-applied thermal interface. This part typically comes with a **Phase Change Material (PCM)** or high-conductivity thermal pad pre-applied to the base, ensuring there are no air gaps between the component and the metal. --- ### 3. Applications This part is commonly found in the following electronic sectors: * **Telecommunications:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Supplies:** Managing heat for MOSFETs or power regulators. ---