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  • CV201210-R18K

  • AI
    The **CV201210-R18K** is a specific surface-mount electronic component, primarily manufactured by **Bourns**. It belongs to the family of **Chip Inductors** designed using multilayer technology. --- ## 1. Technical Specification Breakdown The part number itself acts as a code for its primary electrical and physical characteristics: | Parameter | Specification | Description | | :--- | :--- | :--- | | **Series** | CV201210 | Multilayer Chip Inductor, 0805 Size | | **Inductance** | 0.18 µH (R18) | The nominal inductance value | | **Tolerance** | ±10% (K) | Allowable variance from nominal value | | **Package/Case** | 0805 (2012 Metric) | Physical dimensions: 2.0mm x 1.25mm | | **Material** | Ferrite | Core material for magnetic properties | --- ## 2. Key Electrical Characteristics Below are the typical performance ratings for this specific component: * **Inductance:** 0.18 Microhenries (µH) * **Q Factor (Min):** 25 (measured at a specific test frequency, usually 25 MHz) * **Self-Resonant Frequency (SRF):** ~350 MHz (Minimum) * **DC Resistance (DCR):** ~0.40 Ohms (Maximum) * **Rated Current:** ~200 mA (Maximum current it can handle before overheating or saturating) * **Operating Temperature:** -55°C to +125°C --- ## 3. Physical Construction The "CV" series utilizes a **Multilayer Ferrite Design**. * **Monolithic Structure:** It consists of alternating layers of ferrite paste and conductive electrode paste (usually silver). * **Shielding:** Because the magnetic flux is contained within the multilayer structure, these inductors are inherently **self-shielding**, which reduces electromagnetic interference (EMI) with surrounding components. * **Terminations:** Usually finished with Nickel (Ni) and Tin (Sn) to ensure high solderability and prevent leaching. --- ## 4. Typical Applications Due to its small size and high-frequency performance, the CV201210-R18K is commonly used in: 1. **Mobile Devices:** Cell phones, tablets, and wearable tech. 2. **Filtering:** Reducing noise in low-current DC power lines. 3. **RF Circuits:** Used in matching networks and high-frequency signal processing. 4. **Consumer Electronics:** Computer peripherals and portable gaming consoles. --- ## 5. Alternatives and Equivalents If you are looking for replacements, ensure they match the **0805 footprint** and the **0.18 µH** rating. Popular equivalent series include: * **TDK:** MLF2012 Series * **Murata:** LQM21N Series * **Samsung:** CIH21 Series
    ✨ Follow-up Questions
    • What is the difference between a multilayer inductor and a wire-wound inductor?
    • How does the 'Q factor' affect the performance of this inductor in RF circuits?
    • Can this component be used in high-power power supply stages?