The **M2PHS2L-A1-R** is a specific part number typically associated with high-density, high-speed interconnect systems, most commonly found in the **Metral** or **Millipacs** series by manufacturers like Amphenol Communications Solutions (formerly FCI). Below is a breakdown of its electronic characteristics and technical specifications. --- ### 1. General Component Overview This part is a **2mm High-Speed Header** used primarily in backplane or daughtercard applications. It is designed to handle high-density signal transmissions in telecommunications, data centers, and industrial computing. | Feature | Specification | | :--- | :--- | | **Connector Type** | Header (Male Pins) | | **Pitch** | 2.00 mm | | **Termination Style** | Press-fit (Eye-of-the-needle) | | **Contact Plating** | Gold or Lead-Free GXT (Palladium-Nickel) | | **Mounting Orientation** | Vertical / Right Angle (Series Dependent) | --- ### 2. Breakdown of the Part Number While naming conventions vary slightly by manufacturer, the code generally follows this structure: * **M2P:** Denotes the **Millipacs 2mm** series (Hard Metric). * **HS:** Indicates **High Speed** (optimized for signal integrity and reduced crosstalk). * **2L:** Refers to the physical configuration, often indicating **2-column** or a specific module length. * **A1:** Signifies the specific pin loading pattern or contact arrangement. * **R:** Usually indicates **RoHS Compliance** (Lead-free). --- ### 3. Key Electronic Characteristics #### Signal Integrity The "HS" (High Speed) designation means the internal geometry of the pins and the plastic housing are designed to maintain impedance (typically 100 ohms differential) and minimize signal loss at high frequencies. #### Press-Fit Technology Unlike traditional soldering, this part uses "compliant pins." * **Mechanical:** The pins deform slightly to create a gas-tight seal in the PCB through-hole. * **Electronic Advantage:** Eliminates thermal stress from soldering and allows for easier repair/replacement of backplanes. #### Shielding These connectors often feature integrated grounding shields or are designed to be used with external shields to prevent EMI (Electromagnetic Interference) and RFI (Radio Frequency Interference). --- ### 4. Technical Specifications Table | Parameter | Value (Typical) | | :--- | :--- | | **Current Rating** | 1.0A to 1.5A per contact | | **Dielectric Withstanding Voltage** | 750V AC | | **Insulation Resistance** | 10^4 MΩ minimum | | **Contact Resistance** | < 20 mΩ | | **Operating Temperature** | -55°C to +125°C | --- ### 5. Common Applications * **Telecommunications:** Base stations and switching equipment. * **Data Servers:** High-speed backplanes for blade servers. * **Medical Imaging:** High-bandwidth data transfer between processing boards. * **Industrial Automation:** Ruggedized PLC systems using CompactPCI standards.