The **M2PHSL-15D-R2** is a specific type of high-density electronic connector, typically part of a board-to-board or cable-to-board interconnect system. It is commonly associated with high-speed signal integrity applications and rugged environments. --- ### 1. Technical Specifications Below are the typical technical parameters associated with this component series: | Parameter | Specification | | :--- | :--- | | **Connector Type** | Micro-Pitch Header / Socket | | **Pin Count** | 15 Pins (Positions) | | **Pitch** | Generally 1.27mm or 2.00mm (Series dependent) | | **Mounting Type** | Through-hole or SMT (Surface Mount) | | **Contact Material** | Copper Alloy with Gold Plating | | **Voltage Rating** | 250V AC/DC | | **Current Rating** | 1A - 3A per contact | | **Temperature Range** | -40°C to +105°C | --- ### 2. Breakdown of the Part Number While naming conventions can vary slightly by manufacturer (often associated with brands like **Metz Connect** or specialized header manufacturers), the code generally breaks down as follows: * **M2P:** Refers to the Series (often "Micro 2-Row Pin" or specific product family). * **HSL:** High-Speed Low-profile or Horizontal Solder Lead. * **15D:** Indicates **15 Positions** in a **Dual** (2-row) configuration. * **R2:** Revision 2 or RoHS 2 Compliance status. --- ### 3. Key Electronic Characteristics 1. **Signal Integrity:** Designed to minimize crosstalk and impedance mismatch, making it suitable for data transmission. 2. **Gold Plating:** The "R2" variants usually feature gold-flash or selective gold plating on contacts to prevent oxidation and ensure low contact resistance over time. 3. **Insulation Resistance:** Typically rated at 1000MΩ minimum, ensuring no leakage between adjacent pins in high-voltage or sensitive logic circuits. 4. **Durability:** Rated for approximately 50 to 100 mating cycles depending on the specific plating thickness. --- ### 4. Common Applications * **Industrial Controls:** Connecting PLCs to peripheral sensor boards. * **Telecommunications:** High-density routing in networking hubs. * **Medical Electronics:** Compact signal routing in handheld diagnostic devices. * **Embedded Systems:** Used as a mezzanine connector to stack PCBs (Printed Circuit Boards). ---