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  • STGW40NC60KD

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    ## STGW40NC60KD: Power IGBT Overview The **STGW40NC60KD** is a high-performance Insulated Gate Bipolar Transistor (IGBT) developed by STMicroelectronics. It belongs to the "PowerMESH™" technology family, specifically designed to bridge the gap between MOSFETs and Bipolar transistors by offering high input impedance and low on-state conduction losses. --- ### 1. Key Technical Specifications | Parameter | Symbol | Value | | :--- | :--- | :--- | | **Collector-Emitter Voltage** | $V_{CES}$ | 600 V | | **Continuous Collector Current** | $I_C$ | 40 A (at 100°C) / 70 A (at 25°C) | | **Pulsed Collector Current** | $I_{CP}$ | 150 A | | **Collector-Emitter Saturation Voltage** | $V_{CE(sat)}$ | 2.1 V (Typ) | | **Gate-Emitter Voltage** | $V_{GE}$ | ±20 V | | **Package Type** | - | TO-247 | | **Integrated Diode** | - | Yes (Ultra-fast recovery) | --- ### 2. Core Internal Features The STGW40NC60KD is often referred to as a **Short-Circuit Rated IGBT**. Its internal architecture includes several critical components: * **Trench Gate Field-Stop Technology:** This minimizes conduction losses and provides a very tight variation in switching times, making it efficient for high-frequency applications. * **Integrated Free-Wheeling Diode:** It includes a co-packaged ultra-fast recovery diode. This is essential for inductive loads (like motors), as it protects the IGBT from voltage spikes when the current is switched off. * **Short-Circuit Ruggedness:** It is designed to withstand short-circuit events for a specific duration (typically 10μs), providing a safety margin in industrial environments. --- ### 3. Application Areas The device is optimized for medium-to-high frequency hard-switching topologies. Common use cases include: 1. **Motor Drives:** Used in inverters for controlling AC motors and BLDC motors. 2. **Uninterruptible Power Supplies (UPS):** Managing power conversion from DC battery banks to AC output. 3. **Solar Inverters:** Converting DC energy from photovoltaic panels into grid-compatible AC. 4. **Welding Equipment:** Handling high-current switching requirements. --- ### 4. Typical Connection Diagram (Simplified) Below is a conceptual representation of how the pins are utilized in a circuit: ```text [V_Collector (High Voltage DC)] | +----+----+ | C | [Gate]----| G E |----[Load / Ground] | (K) | +----+----+ | (Integrated Diode) ``` > **Note:** The "K" in the suffix (KD) often denotes the inclusion of the anti-parallel diode. ---
    ✨ Follow-up Questions
    • What are the main differences between this IGBT and a standard Power MOSFET?
    • How does the 'Field-Stop' technology improve efficiency in this component?
    • What are the thermal management requirements for the TO-247 package at 40A?