1. Product Overview:

️· Type: Thermoelectric Modules (TECs) - Used for heating, cooling, and temperature control.
️· Manufacturer: RMT Ltd.
️· Models Covered: 1MD04-024-03, 1MD04-024-05, 1MD04-024-08, 1MD04-024-10, 1MD04-024-12, 1MD04-024-15

2. Performance Specifications (Table):

Model	ΔTmax (°C)	Qmax (W)	Imax (A)	Vmax (V)	R (Ω)	H (mm)	H2 (mm)
1MD04-024-03	69	3.7	2.3	29.0	0.90	0.9	1.4
1MD04-024-05	71	2.4	1.5	15.0	1.50	1.1	1.6
1MD04-024-08	72	1.6	1.0	10.0	2.41	1.4	1.9
1MD04-024-10	72	1.2	0.8	8.0	3.16	1.6	2.1
1MD04-024-12	72	1.1	0.7	7.0	3.61	1.8	2.3
1MD04-024-15	72	0.9	0.5	5.0	4.52	2.1	2.6

️· ΔTmax: Maximum temperature difference (in °C)
️· Qmax: Maximum heat pumping capacity (in Watts)
️· Imax: Maximum current (in Amps)
️· Vmax: Maximum voltage (in Volts)
️· R: Internal resistance (in Ohms)
️· H: Module Height (mm)
️· H2: Module Height with Ceramics (mm)

Important Note: Performance data are specified at 300K in a vacuum.

3. Material & Construction Options:

️· Ceramics:
- Standard: 100% Alumina (Al2O3)
- Other options: Alumina (96%), Aluminum Nitride (AlN)
️· Metallization:
- Ni/Sn(Bi)
- Gold plating
️· Solder Options (for metallization/pre-tinning):
- 94 (PbSnBi, Tmelt = 94°C)
- 117 (In-Sn, Tmelt = 117°C)
- 138 (Sn-Bi, Tmelt = 138°C)
- 183 (Pb-Sn, Tmelt = 183°C)

4. Terminal/Wiring Options

️· Pre-tinned copper
️· Insulated wires (standard, color coded)
️· Wire bonding pads

5. Installation & Handling:

️· Mounting: Mechanical mounting between heat exchangers is recommended.
️· Soldering: Modules can be soldered (RMT provides pre-tinning options).
️· Adhesive: Use appropriate thermally conductive adhesive for bonding.
️· Temperature Limits: Do not exceed 200°C for the TEC itself (assembled at 230°C).
️· Heat Sink: Always use a heat sink on the hot side.

6. Customization Options:

️· TEC Polarity: Can be reversed.
️· Terminal Configuration: Options for posts or pads.
️· Gold Plating: Can be applied to cold-side ceramics

7. Contact Information:

️· RMT Ltd. (address and contact info provided)