OVERVIEW The EP7209 is a complete integrated system on a chip for enabling personal digital audio solutions. It is designed specifically for implementing audio processing algorithms in power sensitive applications. The core-logic functionality of the device is built around an ARM720T embedded processor. FEATURES ■ Audio decoder system-on-chip — Allows for support of multiple audio decompression algorithms — Supports MPEG 1, 2, & 2.5 layer 3 audio decoding, including ISO compliant MPEG 1 & 2 layer 3 support for all standard sample rates and bit rates — Supports bit streams with adaptive bit rates — DAI (Digital Audio Interface) providing glueless interface to low power DACs, ADCs, and Codecs ■ Ultra low power consumption for MP3 playback — 87 mW (typical) for 44.1 kHz samples/sec, 128 kbits/second — 50 mW for 22.05 kHz samples/sec, 64 kbits/second — <1 mW in Standby State ■ ARM720T processor — ARM7TDMI CPU — 8 kbytes of four-way set-associative cache — MMU with 64-entry TLB (transition look-aside buffer) — Write Buffer — Windows® CE enabled — Thumb code support enabled ■ Dynamically programmable clock speeds of 18, 36, 49, and 74 MHz at 2.5 V ■ Performance matching 100 MHz Intel® Pentium-based PC ■ OEM customization — Integrated ARM720T RISC processor — Up to 25 MHz of CPU processing power available (after digital audio decoding) for custom features such as software EQ or tone control, volume control, spectrum analyzer, random play order, etc. — Allows for control of digital voice recorder function ■ LCD controller — Interfaces directly to a single-scan panel monochrome LCD — Panel width is programmable from 32 to 1024 pixels in 16-pixel increments — Video frame buffer size programmable up to 128 kbytes — Bits per pixel of 1, 2, or 4 bits ■ Memory controller — Decodes up to 6 separate memory segments of up to 256 Mbytes each — Each segment can be configured as 8, 16, or 32 bits wide and supports page-mode access — Programmable access time for conventional ROM/SRAM/FLASH memory — Supports Removable FLASH card interface — Enables connection to removable FLASH card for addition of expansion FLASH memory modules ■ 38,400 bytes (0x9600) of on-chip SRAM for fast program execution and/or as a frame buffer ■ On-chip boot ROM for manufacturing support ■ Integrated DAI interface — Connects directly to a Crystal® audio DAC ■ 27-bits of general-purpose I/O — Three 8-bit and one 3-bit GPIO port — Supports scanning keyboard matrix ■ SIR (up to 115.2 kbps) infrared encoder/decoder — IrDA (Infrared Data Association) SIR protocol encoder/decoder ■ DC-to-DC converter interface (PWM) — Provides two 96 kHz clock outputs with programmable duty ratio (from 1-in-16 to 15-in-16) that can be used to drive a DC to DC converter ■ 208-pin LQFP or 256-ball PBGA packages ■ Full JTAG boundary scan and Embedded ICE support
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