FEATURES
• Ultra low VF to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel

APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring

DESCRIPTION
Vishay's FlipKY® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest VF to PCB footprint area in industry. The three pad
0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy
only 1.08 mm2 of board space. The anode and cathode
connections are made through solder bump pads on one
side of the silicon enabling designers to strategically place
the diodes on the PCB. This design not only minimizes board
space but also reduces thermal resistance and inductance,
which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.