GENERAL DESCRIPTION
The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth
and 2D visual light imager that is available for integration into 3D
sensor systems. The functional blocks required for read out, which
include analog-to-digital converters (ADCs), amplifiers, pixel biasing
circuitry, and sensor control logic, are built into the chip to enable a
cost-effective and simple implementation into systems.
The ADSD3030 interfaces electrically to a host system over a
mobile industry processor interface (MIPI), Camera Serial Interface
2 (CSI-2) interface. A lens plus optical band-pass filter for the
imager and an infrared light source plus an associated driver are
required to complete the working subsystem.

FEATURES
► 512 (horizontal) × 640 (vertical) pixel array
► 3.5 μm × 3.5 μm square pixels
► 1/6 inch optical format
► 4-wire SPI or 2-wire I2C serial interface
► MIPI CSI-2 transmitter interface with support for 1 or 2 data
lanes, programmable up to 2.5 Gbps per lane
► Dual, 3.3 V and 1.2 V external supplies, 1.8 V input and output section
► Die size: 3.749 mm± 0.01 mm × 6.4544 mm ± 0.01 mm

APPLICATIONS
► Smartphones
► Augmented reality (AR) and virtual reality (VR)
► Machine vision systems (logistics and inventory)
► Robotics (consumer and industrial)