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XPC750P データシート (PDF) - NXP Semiconductors

XPC750P Datasheet PDF - NXP Semiconductors
部品番号 XPC750P
ダウンロード  XPC750P ダウンロード
ファイルサイズ   717.44 Kbytes
ページ   44 Pages
メーカー  NXP [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo NXP - NXP Semiconductors
部品情報 MPC750A RISC Microprocessor Hardware Specifications

XPC750P Datasheet (PDF)

Go To PDF Page ダウンロード データシート
XPC750P Datasheet PDF - NXP Semiconductors

部品番号 XPC750P
ダウンロード  XPC750P Click to download

ファイルサイズ   717.44 Kbytes
ページ   44 Pages
メーカー  NXP [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo NXP - NXP Semiconductors
部品情報 MPC750A RISC Microprocessor Hardware Specifications

XPC750P データシート (HTML) - NXP Semiconductors


XPC750P 製品詳細

Features
This section summarizes features of the MPC750’s implementation of the PowerPC architecture. Major
features of the MPC750 are as follows:
• Branch processing unit
— Four instructions fetched per clock
— One branch processed per cycle (plus resolving 2 speculations)
— Up to 1 speculative stream in execution, 1 additional speculative stream in fetch
— 512-entry branch history table (BHT) for dynamic prediction
— 64-entry, 4-way set associative branch target instruction cache (BTIC) for eliminating branch
delay slots
• Dispatch unit
— Full hardware detection of dependencies (resolved in the execution units)
— Dispatch two instructions to six independent units (system, branch, load/store, fixed-point unit
1, fixed-point unit 2, or floating-point)
— Serialization control (predispatch, postdispatch, execution serialization)
• Decode
— Register file access
— Forwarding control
— Partial instruction decode
• Load/store unit
— One cycle load or store cache access (byte, half-word, word, double-word)
— Effective address generation
— Hits under misses (one outstanding miss)
— Single-cycle misaligned access within double word boundary
— Alignment, zero padding, sign extend for integer register file
— Floating-point internal format conversion (alignment, normalization)
— Sequencing for load/store multiples and string operations
— Store gathering
— Cache and TLB instructions
— Big- and little-endian byte addressing supported
— Misaligned little-endian support in hardware
• Fixed-point units
— Fixed-point unit 1 (FXU1)—multiply, divide, shift, rotate, arithmetic, logical
— Fixed-point unit 2 (FXU2)—shift, rotate, arithmetic, logical
— Single-cycle arithmetic, shift, rotate, logical
— Multiply and divide support (multi-cycle)
— Early out multiply
• Floating-point unit
— Support for IEEE-754 standard single- and double-precision floating-point arithmetic
— 3 cycle latency, 1 cycle throughput, single-precision multiply-add
— 3 cycle latency, 1 cycle throughput, double-precision add
— 4 cycle latency, 2 cycle throughput, double-precision multiply-add
— Hardware support for divide
— Hardware support for denormalized numbers
— Time deterministic non-IEEE mode
• System unit
— Executes CR logical instructions and miscellaneous system instructions
— Special register transfer instructions
• Cache structure
— 32K, 32-byte line, 8-way set associative instruction cache
— 32K, 32-byte line, 8-way set associative data cache
— Single-cycle cache access
— Pseudo-LRU replacement
— Copy-back or write-through data cache (on a page per page basis)
— Supports all PowerPC memory coherency modes
— Non-blocking instruction and data cache (one outstanding miss under hits)
— No snooping of instruction cache
• Memory management unit
— 128 entry, 2-way set associative instruction TLB
— 128 entry, 2-way set associative data TLB
— Hardware reload for TLBs
— 4 instruction BATs and 4 data BATs
— Virtual memory support for up to 4 exabytes (252) of virtual memory
— Real memory support for up to 4 gigabytes (232) of physical memory
• Level 2 (L2) cache interface (not implemented on MPC740)
— Internal L2 cache controller and 4K-entry tags; external data SRAMs
— 256K, 512K, and 1 Mbyte 2-way set associative L2 cache support
— Copy-back or write-through data cache (on a page basis, or for all L2)
— 64-byte (256K/512K) and 128-byte (1-Mbyte) sectored line size
— Supports flow-through (reg-buf) synchronous burst SRAMs, pipelined (reg-reg) synchronous
burst SRAMs, and pipelined (reg-reg) late-write synchronous burst SRAMs
— Core-to-L2 frequency divisors of ÷1, ÷1.5, ÷2, ÷2.5, and ÷3 supported
• Bus interface
— Compatible with 60x processor interface
— 32-bit address bus
— 64-bit data bus
— Bus-to-core frequency multipliers of 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x
supported
• Integrated power management
— Low-power 2.6/3.3-volt design
— Three static power saving modes: doze, nap, and sleep
• Integrated Thermal Management Assist Unit
— On-chip thermal sensor and control logic
— Thermal Management Interrupt for software regulation of junction temperature.
• Testability
— LSSD scan design
— JTAG interface
• Reliability and serviceability—Parity checking on 60x and L2 cache buses




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NXP Semiconductors について


NXP Semiconductorsは、自動車、産業、通信、消費者市場など、さまざまなアプリケーション向けの幅広い半導体および統合サーキットを設計、開発、製造する公開された多国籍企業です。

同社は2006年に設立され、オランダのアインドホーフェンに本社を置いています。

NXPは、マイクロコントローラー、マイクロプロセッサ、セキュア認証IC、電源管理ICS、RFおよびマイクロ波コンポーネント、センサーソリューションなど、製品の幅広いポートフォリオを提供します。

同社の製品は、エネルギー効率が高く、安全で、信頼性が高いように設計されており、自動車システム、産業用自動化と制御、スマートホームと建物、接続されたデバイスなど、さまざまなアプリケーションで使用されています。

NXPはイノベーションと顧客満足度に専念しており、ニーズを満たすために顧客に最適な半導体ソリューションを提供することに取り組んでいます。

*この情報はあくまでも一般的な情報であり、上記の情報によって生じたいかなる損失や損害についても責任を負うものではありません。




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