POWERSOP2 データシート(PDF) - Amkor Technology

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POWERSOP2 データシート (PDF) - Amkor Technology

POWERSOP2 Datasheet PDF - Amkor Technology


部品番号	POWERSOP2

ダウンロード	POWERSOP2 ダウンロード

ファイルサイズ	367.33 Kbytes

ページ	2 Pages

メーカー	AMKOR [Amkor Technology]

ホームページ	http://www.amkor.com

Logo

部品情報	Exceptional performance through the innovative design of PSOPs offer

POWERSOP2 Datasheet (PDF)

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ダウンロードデータシート

POWERSOP2 Datasheet PDF - Amkor Technology


部品番号	POWERSOP2

ダウンロード	POWERSOP2 Click to download

ファイルサイズ	367.33 Kbytes

ページ	2 Pages

メーカー	AMKOR [Amkor Technology]

ホームページ	http://www.amkor.com

Logo

部品情報	Exceptional performance through the innovative design of PSOPs offer

POWERSOP2 データシート (HTML) - Amkor Technology

POWERSOP2 Datasheet HTML 1Page - Amkor Technology

POWERSOP2 Datasheet HTML 2Page - Amkor Technology

同様の部品番号 - POWERSOP2

メーカー	部品番号	データシート	部品情報
Amkor Technology	POWERSOP	311Kb / 2P	Power Small Outline Package,PowerSOP

同様の説明 - POWERSOP2

メーカー	部品番号	データシート	部品情報
Amkor Technology	MQFPPOWERQUAD2	99Kb / 2P	Exceptional thermal and electrical performance by design include the following
National Semiconductor ...	AN-2026	450Kb / 8P	The Effect of PCB Design on the Thermal Performance of SIMPLE SWITCHER
STMicroelectronics	UM1755	1Mb / 123P	The purpose of this document is to describe the design of the application 17-Nov-2014
STMicroelectronics	UM1865	1Mb / 132P	The purpose of this document is to describe the design of the application 04-Mar-2015
M/A-COM Technology Solu...	MASW-000932	618Kb / 7P	Exceptional Broadband Performance
SYNERGY MICROWAVE CORPO...	DCRO119185-12-1	345Kb / 3P	Exceptional Phase Noise Performance
	DCRO221226-8	350Kb / 3P	Exceptional Phase Noise Performance
	DCSR4143-8	372Kb / 3P	Exceptional Phase Noise Performance
M/A-COM Technology Solu...	MASW-000932	618Kb / 7P	Exceptional Broadband Performance
Cherry Semiconductor Co...	SR-4300	134Kb / 2P	ExpressCards Offer Even More Speed and Performance than the PC Card

Amkor Technology について

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*この情報はあくまでも一般的な情報であり、上記の情報によって生じたいかなる損失や損害についても責任を負うものではありません。

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