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SOIC データシート (PDF) - Amkor Technology

SOIC Datasheet PDF - Amkor Technology
部品番号 SOIC
ダウンロード  SOIC ダウンロード
ファイルサイズ   780.44 Kbytes
ページ   3 Pages
メーカー  AMKOR [Amkor Technology]
ホームページ  http://www.amkor.com
Logo AMKOR - Amkor Technology
部品情報 ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC Datasheet (PDF)

Go To PDF Page ダウンロード データシート
SOIC Datasheet PDF - Amkor Technology

部品番号 SOIC
ダウンロード  SOIC Click to download

ファイルサイズ   780.44 Kbytes
ページ   3 Pages
メーカー  AMKOR [Amkor Technology]
ホームページ  http://www.amkor.com
Logo AMKOR - Amkor Technology
部品情報 ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC データシート (HTML) - Amkor Technology


SOIC 製品詳細

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal efficiency
Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability




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同様の説明 - SOIC

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Amkor Technology について


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*この情報はあくまでも一般的な情報であり、上記の情報によって生じたいかなる損失や損害についても責任を負うものではありません。




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