Applications
The small size and weight along with excellent thermal and elec trical performance make the MicroLeadFrame® package an ideal choice for handheld portable applications such as smartphones and tablets or any other application where size, weight and package performance are required.

Features
Small size (reduce package footprint by 50% or more and improved RF performance) and weight
Standard leadframe process flow and equipment
Excellent thermal and electrical performance
0.35 mm to 1.45 mm maximum height
I/O count range: 1-180 available with conventional MLF®; >200 possible with rtMLF®
1-13 mm body size
Thin profile and superior die-to-body size ratio
Pb-free/Green
Flexible designs and high yields
Saw and punch versions available