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LMV1032 データシート (PDF) - Texas Instruments

LMV1032 Datasheet PDF - Texas Instruments
部品番号 LMV1032
ダウンロード  LMV1032 ダウンロード
ファイルサイズ   576.07 Kbytes
ページ   20 Pages
メーカー  TI2 [Texas Instruments]
ホームページ  https://www.ti.com
Logo TI2 - Texas Instruments
部品情報 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

LMV1032 Datasheet (PDF)

Go To PDF Page ダウンロード データシート
LMV1032 Datasheet PDF - Texas Instruments

部品番号 LMV1032
ダウンロード  LMV1032 Click to download

ファイルサイズ   576.07 Kbytes
ページ   20 Pages
メーカー  TI2 [Texas Instruments]
ホームページ  https://www.ti.com
Logo TI2 - Texas Instruments
部品情報 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

LMV1032 データシート (HTML) - Texas Instruments


LMV1032 製品詳細

1FEATURES
2• (Typical LMV1032-15, 1.7V Supply; Unless
Otherwise Noted)
• Output Voltage Noise (A-weighted) −89 dBV
• Low Supply Current 60 μA
• Supply Voltage 1.7V to 5V
• PSRR 70 dB
• Signal to Noise Ratio 61 dB
• Input Capacitance 2 pF
• Input Impedance >100 MΩ
• Output Impedance <200Ω
• Max Input Signal 170 mVPP
• Temperature Range −40°C to 85°C
• Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology.

APPLICATIONS
• Mobile Communications - Bluetooth
• Automotive Accessories
• Cellular Phones
• PDAs
• Accessory Microphone Products

DESCRIPTION
The LMV1032s are an audio amplifier series for small
form factor electret microphones. They are designed
to replace the JFET preamp currently being used.
The LMV1032 series is ideal for extended battery life
applications, such as a Bluetooth communication link.
The addition of a third pin to an electret microphones
that incorporates an LMV1032 allows for a dramatic
reduction in supply current as compared to the JFET
equipped electret microphone. Microphone supply
current is thus reduced to 60 μA, assuring longer
battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed
voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance
over the voice bandwidth, excellent power supply
rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra
thin DSBGA lead free packages and are thus ideally
suited for the form factor of miniature electret
microphone packages. These extremely miniature
packages have the Large Dome Bump (LDB)
technology. This DSBGA technology is designed for
microphone PCBs requiring 1 kg adhesion criteria.




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同様の説明 - LMV1032

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