DESCRIPTION
The Bridges series from ST Microelectronics has been designed to allow a better standardization of packages on boards principally designedwith ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products.

FEATURES AND BENEFITS
■ COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES AND TRANSISTORS.
■ EXCELLENTTHERMAL TRANSFER BETWEEN JUNCTION AND HEATSINK
■ UL PENDING