1 FEATURES
1• Integrates Synchronous Buck Driver and
NexFET™ Power MOSFETS for High Power
Density and High Efficiency
• 25-A Output Current Capability for DSP and ASIC
• 4.7-V to 14-V Input Voltage Range
• Operational up to 2 MHz Switching Frequency
• Built-In High-Side Current Protection
• DCR Current Sensing for Overcurrent Protection
and Output Current Monitoring
• Voltage Proportional to Load Current Monitor
Output
• Tri-state PWM Input for Power Stage Shutdown
• UVLO Housekeeping Circuit
• Integrated Thermal Shutdown
• 40-Pin, 5 mm x 7 mm, PQFN PowerStack™
Package

2 APPLICATIONS
• Digital or Analog POL Power Modules
• High Power Density DC-DC Converters for
Telecom and Networking Applications

3 DESCRIPTION
UCD74120 is a multi-chip module integrating a driver
device and two NexFET power MOSFETs into a
thermally enhanced compact, 5 mm × 7 mm, QFN
package. A 25-A output current capability makes the
device suitable for powering DSP and ASIC. The
device is designed to complement digital or analog
PWM controllers. The PWM input of the driver device
is 3-state compatible. Two driver circuits provide high
charge and discharge current for the high-side Nchannel
FET switch and the low-side N-channel FET
synchronous rectifier in a synchronous buck
converter.
Output current is measured and monitored by a
precision current sensing amplifier that processes the
voltage present across an external current sense
element. The amplified signal is available for use by
the PWM controller on the IMON pin. On-board
comparators monitor the voltage across the high-side
switch and the voltage across the external current
sense element to safeguard the power stage from
sudden high-current loads. Blanking delay is set for
the high-side comparator by a single resistor in order
to avoid false reports coincident with switching edge
noise. In the even of a high-side fault or an
overcurrent fault, the high-side FET is turned off and
the fault flag (FLT) is asserted to alert the PWM
controller.